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Toyota Prius 4 PCU Power Modules
2016/09/01
Toyota Prius 4 PCU modules integrate IGBT and freewheeling diodes onto innovative double side cooling packaging for hybrid electric vehicles, allowing.. more TSV Stacked Memory Patent Landscape Analysis
2016/09/01
An emerging market with leading industrials and first patent litigations; Who owns what? more Point-of-Need Testing: Application of Microfluidic Technologies 2016 report
2016/09/01
Decentralized testing for both human and non-human in-vitro diagnostics is increasingly taking advantage of innovative microfluidic technologies more Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
2016/09/01
GaN power devices: a promising, fast-growing market more Sapphire Applications & Market 2016: LED and Consumer Electronics
2016/09/01
As the prospect of adoption in smartphone display covers dwindles, what is the future for the sapphire industry? more Qualcomm Snapdragon Sense ID 3D Qualcomm's New Ultrasonic Fingerprint Sensor
2016/08/01
Qualcomm has introduced the Snapdragon Sense ID, the latest in cutting-edge biometric fingerprint authentication, in the LeMax Pro smartphone from LeE.. more Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Microbolometer
2016/08/01
The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17μm pixels from the South Korean I3system. more Uncooled Infrared Imaging Technology and Market Trends 2016
2016/08/01
In a dynamic IR imaging market with ever more competitors, technologies and products, uncooled IR imager shipments are expected to grow at 15.8% CAGR .. more Wolfspeed C3M? Platform SiC 900V MOSFET
2016/08/01
Wolfspeed (a Cree Company) has proposed the first 900V SiC MOSFET device. The device is a planar MOSFET with lower Rdson, smaller size, and higher cur.. more Fan-Out: Technologies & Market Trends 2016
2016/08/01
Fan-Out packaging: the most dynamic advanced packaging platform. Will it be sustainable long-term? more